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| Highlights: |
| Small desktop version |
| Quick and easy conversion to various device packages |
| Low cost of investment |
| Test and Programming of tube stacked ICs or similar devices |
| Customized solution for optimal conveying of shrink packages |
| Application specific stimulus for test of sensor devices |
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| Package types: |
DIP, SIP, ZIP, PLCC, LCC, SOJ, SOIC, TSOP, QSOP, VSOP, SSOP, SOT,TO, MLP, QFN
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| Technical Data: |
| Throughput at zero test time up to 3300 UPH (including contact action) |
| Input capacity 1 tube |
| Output capacity 3 tubes (3 BIN sort) |
| Tester interface parallel test (Start testm End of test, 3 BIN input |
Dimensions incl. base plate 340 x 500 x 570 mm
(width x depth x height) |
| max. Weight 14 kg (30 lbs.) |
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